The Hirose DF58 Series offers compact, low-profile wire-to-board connectors with a 1.0mm stacking height, ideal for small devices. Featuring a vertical mating design for easy assembly and a proprietary ViSe Lock mechanism to prevent cable disconnection, it supports high-current applications up to 3.0A (28AWG) through optimized contact resistance. Available in 2, 3, 4, or 6 positions with a 1.2mm pitch, it includes SMT headers and crimp sockets, rated for 100V AC/DC and operating temperatures from -55℃ to 85℃. Constructed with halogen-free, UL94V-0 LCP housings and tin-plated contacts, it ensures reliability in harsh environments. Suitable for compact electronics requiring efficient power delivery, the DF58 combines durability, high current capacity, and space-saving design.
Connector Type | Header, Socket, Contact | Number of Positions | 2, 3, 4, 6 |
Rated Current | 2.0, 2.5, 3.0A | Mounting Pitch | 1.2 mm |
Rated Voltage(AC) | AC 100.0V | Mounting Side | Standard on-Board |
Rated Voltage(DC) | DC100.0V | Mounting Style | SMT |
Contact Pitch | 1.2 mm | Connector Orientation | Straight |
Mating/Unmating Cycles | 10 | Contact Plating | Tin |
Plating Thickness | 1.0μm | Housing Color | Black, Beige |
Wire Termination Method | Crimping | Recommended Wire Type | Discrete wire |
Recommended Min.Wire Size (AWG) | 30 | Recommended Max.Wire Size (AWG) | 28 |
Operating Temperature Min. | -55℃ | Operating Temperature Max. | 85℃ |
Part No. | HRS No. | No.of contacts |
DF58-2S-1.2C | 666-1006-0 | 2 |
DF58-3S-1.2C | 666-1007-0 | 3 |
DF58-4S-1.2C | 666-1008-0 | 4 |
DF58-6S-1.2C | 666-1010-0 | 6 |
Send your sample or drawing/schematic for quote price→ Feedback with quotation(1~3 days) → Confirm quotation → Arrange sample you for approval→ [Make mold if needed (7 days) →Mold test] → Making samples(1~3 days)→ Samples test(Approval) → place order for Mass production(2~3 weeks)→ Quality checking→ Packing → Delivery → After Service → Repeat Order.