Hirose DF53 Connector
The DF53 Series by Hirose Electric is a 0.6mm pitch wire-to-board connector designed for small, high-density electronic devices. Featuring an industry-leading low profile (1.45mm height) and robust construction, it supports up to 1.3A current when using two positions for power delivery with 32 AWG cables. The connector incorporates a double-lock mechanism for secure mating, box-shaped contacts to prevent deformation, and visual slits to confirm full engagement. It operates across a wide temperature range (-55°C to +85°C), meets halogen-free standards, and uses UL94V-0-rated polyamide housings with tin-plated copper alloy contacts. Available in 2-20 positions, the SMT-compatible receptacles and crimp plugs suit applications requiring reliability in compact spaces, such as wearables, IoT devices, and portable electronics. The series includes automated assembly-friendly packaging and complies with stringent electrical and environmental performance criteria.

Features
- 0.6mm Pitch Wire-to-Board Connector
- Up to 1.3A Max. when using 2 positions for power.
- Robust design withstands cable wiring.
- Box-shaped contact design provides contact stability
- Crimp case design prevents incomplete mating
- Halogen Free
DataSheet
| Connector Type |
Plug, Receptacle, Contact |
Number of Positions |
2, 3, 4, 5, 6, 8, 10, 12, 14, 16, 18, 20 |
| Rated Current |
1.3A |
Mounting Pitch |
0.6 mm |
| Rated Voltage(AC) |
AC 50.0V |
Contact Pitch |
0.6mm |
| Rated Voltage(DC) |
DC50.0V |
Connector Orientation |
Straight, Right angle |
| Mounting Style |
SMT |
Contact Plating |
Tin |
| PCB Stabilizing Feature |
Soldering |
Housing Color |
Black |
| Mating/Unmating Cycles |
20 |
Recommended Max.Wire Size (AWG) |
32 |
| Wire Termination Method |
Crimping |
Recommended Max.Wire Size (mm²) |
0.4 mm² |
| Operating Temperature Min. |
-55℃ |
Operating Temperature Max. |
85℃ |
Crimp Plug
| Part No. |
HRS No. |
No.of Pos. |
| DF53-2P-0.6C |
CL0668-1013-0-00 |
2 |
| DF53-3P-0.6C |
CLO668-1014-0-00 |
3 |
| DF53-4P-0.6C |
CLO668-1015-0-00 |
4 |
| DF53-5P-0.6C |
CLO668-1016-0-00 |
5 |
| DF53-6P-0.6C |
CLO668-1017-0-00 |
6 |
| DF53-8P-0.6C |
CL0668-1018-0-00 |
8 |
| DF53-10P-0.6C |
CL0668-1019-0-00 |
10 |
| DF53-12P-0.6C |
CL0668-1020-0-00 |
12 |
| DF53-14P-0.6C |
CL0668-1021-0-00 |
14 |
| DF53-16P-0.6C |
CL0668-1022-0-00 |
16 |
| DF53-18P-0.6C |
CLO668-1023-0-00 |
18 |
| DF53-20P-0.6C |
CLO668-1024-0-00 |
20 |
Applications
- Consumer Electronics: Wearables (smartwatches, fitness trackers), smartphones, tablets, and IoT devices where space-saving and low-profile designs are critical.
- Medical Devices: Portable diagnostic tools, monitoring equipment, and miniaturized medical electronics demanding reliable signal/power connections.
- Automotive Electronics: Sensors, infotainment systems, and compact control modules requiring vibration resistance and operation across extreme temperatures (-55°C to +85°C).
- Industrial Automation: Robotics, micro-motors, and dense PCB assemblies in factory automation or control systems.
- Telecommunications: High-density connectors for 5G modules, routers, and networking hardware.
- Drones/UAVs: Lightweight, durable connections for flight controllers and miniaturized avionics.
- Advanced Robotics: Micro-robotic joints, surgical robots, and collaborative robots (cobots) requiring precise, vibration-resistant connections in confined spaces.
- Energy & Environmental Monitoring: Compact solar inverters, battery management systems (BMS) for renewable energy storage, and portable environmental sensors (air quality, temperature).
- Augmented/Virtual Reality (AR/VR): Lightweight headsets, motion controllers, and haptic feedback devices where ultra-compact connectors reduce bulk without sacrificing power/signal integrity.
- Edge Computing & Microservers: Miniaturized edge devices, single-board computers (e.g., Raspberry Pi add-ons), and microservers needing high-density interconnects for power and data.
- Smart Agriculture: Soil sensors, drone-mounted crop monitors, and IoT-enabled farming tools exposed to dust, moisture, and temperature fluctuations.
- Aerospace & Satellite Systems: CubeSats, UAV payloads, and avionics modules requiring lightweight, high-reliability connectors for extreme thermal cycling and shock/vibration.
- Defense & Military: Ruggedized communication devices, handheld tactical equipment, and encrypted data links meeting MIL-STD specs for harsh environments.
- Pro Audio & Wearable Tech: High-fidelity wireless earbuds, hearing aids, and modular audio gear demanding durable, low-resistance connections in moisture-prone environments.
- Smart Home & Building Automation: Micro-switches, HVAC controllers, and security systems (e.g., door/window sensors) needing long-term reliability in confined housings.
Support Custom Wire Harness Assembly
- Connectors: 2P to 20P.
- Wire Gauge:
- depends on your needs
- recommend by us
- Wire Colors: Available in a wide range including white, black, red, yellow, blue, green, brown, orange, purple, grey, and more.
- Wire Length: Fully customizable to your specifications.
- Wiring Diagram: Tailor-made to meet your project needs.
- Custom type:
- Send drawing to customize.
- Send a sample to customize.
- Tell us as many details as possible to customize.
- Minimum Order: 200 pieces per order.

Customize Your Wire Harness
Send your sample or drawing/schematic for quote price→ Feedback with quotation(1~3 days) → Confirm quotation → Arrange sample you for approval→ [Make mold if needed (7 days) →Mold test] → Making samples(1~3 days)→ Samples test(Approval) → place order for Mass production(2~3 weeks)→ Quality checking→ Packing → Delivery → After Service → Repeat Order.